Issued Patents 2002
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495773 | Wire bonded device with ball-shaped bonds | Ryuji Nomoto, Kazuto Tsuji, Junichi Kasai | 2002-12-17 |
| 6476503 | Semiconductor device having columnar electrode and method of manufacturing same | Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Ryuji Nomoto +3 more | 2002-11-05 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara, Toshio Hamano +5 more | 2002-10-29 |
| 6462424 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure | Masaaki Seki, Katsuhiro Hayashida, Toshio Hamano | 2002-10-08 |
| 6459161 | Semiconductor device with connection terminals in the form of a grid array | Masayoshi Hirata, Yasuhiro Suzuki, Tetsuya Hiraoka | 2002-10-01 |
| 6433418 | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism | Tetsuya Fujisawa, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki +4 more | 2002-08-13 |
| 6383842 | Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom | Akira Takashima, Shinichirou Taniguchi | 2002-05-07 |
| 6348728 | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer | Yoshitaka Aiba, Toshio Hamano | 2002-02-19 |