Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472763 | Semiconductor device with bumps for pads | Tomoyuki Fukuda | 2002-10-29 |
| 6462415 | Semiconductor device as an object of thickness reduction | Masahiko Ishiguri, Yutaka Makino, Koichi Murata | 2002-10-08 |
| 6408826 | Common rail and method of manufacturing the same | Kikuo Asada, Masayoshi Usui, Kazunori Takikawa, Ryuichi Kusanagi | 2002-06-25 |
| 6397881 | METHOD FOR IMPROVING FATIGUE STRENGTH DUE TO REPEATED PRESSURE AT BRANCH HOLE PART IN MEMBER FOR HIGH PRESSURE FLUID, BRANCH HOLE PART OF MEMBER FOR HIGH PRESSURE FLUID FORMED BY THE METHOD, AND MEMBER FOR HIGH PRESSURE FLUID WITH BUILT-IN SLIDER HAVING THE BRANCH HOLE | Kikuo Asada, Masayoshi Usui, Kazunori Takikawa, Ryuichi Kusanagi | 2002-06-04 |
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Hirohisa Matsuki, Fumihiko Taniguchi, Kunio Kodama, Masataka Mizukoshi, Hiroyuki Matsui | 2002-02-05 |