Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6347037 | Semiconductor device and method of forming the same | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +3 more | 2002-02-12 |
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Hirohisa Matsuki, Fumihiko Taniguchi, Kunio Kodama, Eiji Watanabe, Hiroyuki Matsui | 2002-02-05 |