Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6490033 | Method of thin film process control and calibration standard for optical profilometry step height measurement | Gustav E. Derkits, Jr., Franklin Roy Dietz, Ranjani Muthiah, Sonja Radelow | 2002-12-03 |
| 6437868 | In-situ automated contactless thickness measurement for wafer thinning | Duane Donald Wendling, Charles Lentz, Bryan P. Segner, Gustav E. Derkits, Jr., Wan-ning Wu +1 more | 2002-08-20 |
| 6342442 | Kinetically controlled solder bonding | David L. Angst, John W. Osenbach, Gustav E. Derkits, Jr., Brian Stauffer Auker | 2002-01-29 |