Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6437868 | In-situ automated contactless thickness measurement for wafer thinning | David Coult, Charles Lentz, Bryan P. Segner, Gustav E. Derkits, Jr., Wan-ning Wu +1 more | 2002-08-20 |