Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489240 | Method for forming copper interconnects | John A. Iacoponi, Paul R. Besser, Frederick N. Hause, Frank Mauersberger, Errol Todd Ryan +1 more | 2002-12-03 |
| 6413846 | Contact each methodology and integration scheme | Paul R. Besser, Errol Todd Ryan, Frederick N. Hause, Frank Mauersberger, William S. Brennan +1 more | 2002-07-02 |
| 6368184 | Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes | — | 2002-04-09 |