Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641988 | Multi-layered, integrated circuit package having reduced parasitic noise characteristics | Chin-Ching Huang, Ramachandra A. Rao, Fernand N. Forcier, Jr. | 1997-06-24 |
| 5625225 | Multi-layered, integrated circuit package having reduced parasitic noise characteristics | Chin-Ching Huang, Ramachandra A. Rao, Fernand N. Forcier, Jr. | 1997-04-29 |
| 5598031 | Electrically and thermally enhanced package using a separate silicon substrate | Richard L. Groover, William K. Shu, George Fujimoto | 1997-01-28 |