Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5675179 | Universal test die and method for fine pad pitch designs | Brian D. Richardson | 1997-10-07 |
| 5598031 | Electrically and thermally enhanced package using a separate silicon substrate | Richard L. Groover, Sang S. Lee, George Fujimoto | 1997-01-28 |