Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702584 | Enhanced plating adhesion through the use of metallized fillers in plastic substrate | Lakhi Nandlal Goenka, Michael George Todd | 1997-12-30 |
| 5685475 | Apparatus for cooling printed circuit boards in wave soldering | Vivek Amir Jairazbhoy, Timothy J. Yerdon | 1997-11-11 |
| 5600181 | Hermetically sealed high density multi-chip package | Patrick M. Scott, Michael A. Mele | 1997-02-04 |