Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702584 | Enhanced plating adhesion through the use of metallized fillers in plastic substrate | Lakhi Nandlal Goenka, Andrew Z. Glovatsky | 1997-12-30 |
| 5655291 | Forming rigid circuit board | Robert Edward Belke, Robert Joseph Gordon | 1997-08-12 |
| 5654081 | Integrated circuit assembly with polymeric underfill body | — | 1997-08-05 |
| 5639010 | Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices | Mayank R. Parikh, Jorge Santana, Mauricio Ciocler | 1997-06-17 |