MM

Michael A. Mele

LM Lockheed Martin: 1 patents #52 of 335Top 20%
📍 Endicott, NY: #24 of 68 inventorsTop 40%
🗺 New York: #1,999 of 7,187 inventorsTop 30%
Overall (1997): #102,869 of 185,788Top 60%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5600181 Hermetically sealed high density multi-chip package Patrick M. Scott, Andrew Z. Glovatsky 1997-02-04