PS

Patrick M. Scott

LM Lockheed Martin: 1 patents #52 of 335Top 20%
📍 Newark Valley, NY: #1 of 9 inventorsTop 15%
🗺 New York: #1,999 of 7,187 inventorsTop 30%
Overall (1997): #95,106 of 185,788Top 55%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5600181 Hermetically sealed high density multi-chip package Andrew Z. Glovatsky, Michael A. Mele 1997-02-04