Issued Patents 1997
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688716 | Fan-out semiconductor chip assembly | John W. Smith, Tony Faraci | 1997-11-18 |
| 5685885 | Wafer-scale techniques for fabrication of semiconductor chip assemblies | Igor Y. Khandros | 1997-11-11 |
| 5682061 | Component for connecting a semiconductor chip to a substrate | Igor Y. Khandros | 1997-10-28 |
| 5679977 | Semiconductor chip assemblies, methods of making same and components for same | Igor Y. Khandros | 1997-10-21 |
| 5663106 | Method of encapsulating die and chip carrier | Konstantine Karavakis, John W. Smith, Craig Mitchell | 1997-09-02 |
| 5659952 | Method of fabricating compliant interface for semiconductor chip | Zlata Kovac, Craig Mitchell, John W. Smith | 1997-08-26 |
| 5650914 | Compliant thermal connectors, methods of making the same and assemblies incorporating the same | John W. Smith | 1997-07-22 |
| 5640761 | Method of making multi-layer circuit | Igor Y. Khandros, Gary W. Grube | 1997-06-24 |
| 5632631 | Microelectronic contacts with asperities and methods of making same | Joseph Fjelstad, John W. Smith, James Zaccardi, A. Christian Walton | 1997-05-27 |
| 5629239 | Manufacture of semiconductor connection components with frangible lead sections | John W. Smith, Konstantine Karavakis, Joseph Fjelstad | 1997-05-13 |
| 5619017 | Microelectronic bonding with lead motion | Zlata Kovac, John Grange | 1997-04-08 |
| 5615824 | Soldering with resilient contacts | Joseph Fjelstad, John W. Smith | 1997-04-01 |
| 5597470 | Method for making a flexible lead for a microelectronic device | Konstantine Karavakis, Joseph Fjelstad | 1997-01-28 |
| 5590460 | Method of making multilayer circuit | John W. Smith, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 1997-01-07 |