Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5663106 | Method of encapsulating die and chip carrier | Konstantine Karavakis, Thomas H. DiStefano, John W. Smith | 1997-09-02 |
| 5659952 | Method of fabricating compliant interface for semiconductor chip | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 1997-08-26 |