Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5663106 | Method of encapsulating die and chip carrier | Thomas H. DiStefano, John W. Smith, Craig Mitchell | 1997-09-02 |
| 5629239 | Manufacture of semiconductor connection components with frangible lead sections | Thomas H. DiStefano, John W. Smith, Joseph Fjelstad | 1997-05-13 |
| 5597470 | Method for making a flexible lead for a microelectronic device | Thomas H. DiStefano, Joseph Fjelstad | 1997-01-28 |
| 5590460 | Method of making multilayer circuit | Thomas H. DiStefano, John W. Smith, Zlata Kovac, Joseph Fjelstad | 1997-01-07 |