Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5685885 | Wafer-scale techniques for fabrication of semiconductor chip assemblies | Thomas H. DiStefano | 1997-11-11 |
| 5682061 | Component for connecting a semiconductor chip to a substrate | Thomas H. DiStefano | 1997-10-28 |
| 5679977 | Semiconductor chip assemblies, methods of making same and components for same | Thomas H. DiStefano | 1997-10-21 |
| 5640761 | Method of making multi-layer circuit | Thomas H. DiStefano, Gary W. Grube | 1997-06-24 |