Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Naoki Uchiyama, Masayoshi Kohinata, Yoshiaki Okuhama, Seishi Masaki, Masakazu Yoshimoto | 1997-07-29 |