Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Naoki Uchiyama, Masayoshi Kohinata, Akihiro Masuda, Seishi Masaki, Masakazu Yoshimoto | 1997-07-29 |
| 5618404 | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use | Seishi Masaki, Takao Takeuchi, Yoshiharu Matsuda, Masakazu Yoshimoto | 1997-04-08 |