Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Naoki Uchiyama, Masayoshi Kohinata, Akihiro Masuda, Yoshiaki Okuhama, Seishi Masaki | 1997-07-29 |
| 5618404 | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use | Yoshiaki Okuhama, Seishi Masaki, Takao Takeuchi, Yoshiharu Matsuda | 1997-04-08 |
| 5613913 | Method for developing attractions in a shooting game system | Shinichi Ikematsu, Hiroshi Kawakami, Satoshi Nakano, Tatsuya Kouno, Keisuke Hiromi | 1997-03-25 |