Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Masayoshi Kohinata, Akihiro Masuda, Yoshiaki Okuhama, Seishi Masaki, Masakazu Yoshimoto | 1997-07-29 |
| 5643293 | Suturing instrument | Takahiro Kogasaka, Toshihiko Suzuta, Shiro Bito, Minoru Tsuruta, Kunihide Kaji | 1997-07-01 |
| 5626937 | Composite cards | Masaki Morikawa, Naoyuki Hosoda | 1997-05-06 |