Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5700739 | Method of multi-step reactive ion etch for patterning adjoining semiconductor metallization layers | Wei-Kun Yeh | 1997-12-23 |
| 5652172 | Method for controlling the etch profile of an aperture formed through a multi-layer insulator layer | Peng Yung-Sung, Shau-Tsung Yu, Min-Yi Lin | 1997-07-29 |