WY

Wei-Kun Yeh

TSMC: 1 patents #44 of 161Top 30%
Overall (1997): #60,980 of 185,788Top 35%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5700739 Method of multi-step reactive ion etch for patterning adjoining semiconductor metallization layers An-Min Chiang 1997-12-23