EH

Erwin Hammerl

SA Siemens Aktiengesellschaft: 4 patents #5 of 792Top 1%
IBM: 3 patents #221 of 3,557Top 7%
KT Kabushiki Kaisha Toshiba: 1 patents #480 of 1,730Top 30%
📍 Stormville, NY: #2 of 7 inventorsTop 30%
🗺 New York: #237 of 7,187 inventorsTop 4%
Overall (1997): #8,398 of 185,788Top 5%
4
Patents 1997

Issued Patents 1997

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
5674769 Process for forming deep trench DRAMs with sub-groundrule gates Johann Alsmeier, Christine Dehm, Reinhard Stengl 1997-10-07
5670805 Controlled recrystallization of buried strap in a semiconductor memory device Jack A. Mandelman, Herbert L. Ho, Junichi Shiozawa, Reinhard Stengl 1997-09-23
5656535 Storage node process for deep trench-based DRAM Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, David M. Dobuzinsky, Jack A. Mandelman +1 more 1997-08-12
5643823 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Herbert L. Ho, David M. Dobuzinsky, J. Herbert Palm, Stephen G. Fugardi, Atul Ajmera +2 more 1997-07-01