Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5637917 | Lead frame assembly for a semiconductor device | Yoshihiro Tomita, Michitaka Kimura | 1997-06-10 |
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Goro Izuta, Shunichi Abe, Yoshirou Nishinaka, Katsuyuki Fukutome, Naoto Ueda +2 more | 1997-03-11 |