Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668404 | Semiconductor device and production method thereof | Seizo Ohmae | 1997-09-16 |
| 5659199 | Resin sealed semiconductor device | Ryuichiro Mori, Tatsuhiko Akiyama, Michitaka Kimura | 1997-08-19 |
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Goro Izuta, Yoshirou Nishinaka, Katsuyuki Fukutome, Naoto Ueda, Toshio Takeuchi +2 more | 1997-03-11 |