Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Goro Izuta, Shunichi Abe, Katsuyuki Fukutome, Naoto Ueda, Toshio Takeuchi +2 more | 1997-03-11 |