Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5659199 | Resin sealed semiconductor device | Ryuichiro Mori, Shunichi Abe, Tatsuhiko Akiyama | 1997-08-19 |
| 5637917 | Lead frame assembly for a semiconductor device | Yoshihiro Tomita, Yoshihiro Kashiba | 1997-06-10 |