Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5679605 | Multilevel interconnect structure of an integrated circuit formed by a single via etch and dual fill process | Robert Dawson, H. Jim Fulford, Fred N. Hause, Basab Bandyopadhyay, Mark W. Michael | 1997-10-21 |