Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5354490 | Slurries for chemical mechanically polishing copper containing metal layers | Trung T. Doan | 1994-10-11 |
| 5329734 | Polishing pads used to chemical-mechanical polish a semiconductor substrate | — | 1994-07-19 |
| 5314843 | Integrated circuit polishing method | Gurtej S. Sandhu, Trung T. Doan | 1994-05-24 |
| 5300155 | IC chemical mechanical planarization process incorporating slurry temperature control | Gurtej S. Sandhu | 1994-04-05 |