VM

Voya R. Markovich

IBM: 4 patents #59 of 3,003Top 2%
📍 Endwell, NY: #2 of 34 inventorsTop 6%
🗺 New York: #225 of 7,004 inventorsTop 4%
Overall (1994): #4,050 of 165,921Top 3%
4
Patents 1994

Issued Patents 1994

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
5374454 Method for conditioning halogenated polymeric materials and structures fabricated therewith Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Linda C. Matthew +4 more 1994-12-20
5316788 Applying solder to high density substrates Eric P. Dibble, Steven L. Hanakovic, Daniel S. Niedrich, Gary Paul Vlasak, Richard Stuart Zarr +1 more 1994-05-31
5298685 Interconnection method and structure for organic circuit boards Perminder S. Bindra, Ross Downey Havens, Jaynal A. Molla 1994-03-29
5292688 Solder interconnection structure on organic substrates and process for making Richard Hsiao, Jack M. McCreary, Donald P. Seraphim 1994-03-08