Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5292688 | Solder interconnection structure on organic substrates and process for making | Jack M. McCreary, Voya R. Markovich, Donald P. Seraphim | 1994-03-08 |
| 5280414 | Au-Sn transient liquid bonding in high performance laminates | Charles R. Davis, James R. Loomis, Jae Man Park, Jonathan D. Reid | 1994-01-18 |