Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5292688 | Solder interconnection structure on organic substrates and process for making | Richard Hsiao, Voya R. Markovich, Donald P. Seraphim | 1994-03-08 |
| 5274913 | Method of fabricating a reworkable module | Kurt R. Grebe, Darbha Suryanarayana, Ho-Ming Tong | 1994-01-04 |