ED

Eric P. Dibble

IBM: 1 patents #741 of 3,003Top 25%
📍 Endicott, NY: #20 of 64 inventorsTop 35%
🗺 New York: #1,860 of 7,004 inventorsTop 30%
Overall (1994): #137,890 of 165,921Top 85%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5316788 Applying solder to high density substrates Steven L. Hanakovic, Voya R. Markovich, Daniel S. Niedrich, Gary Paul Vlasak, Richard Stuart Zarr +1 more 1994-05-31