LH

Louis L. Hsu

IBM: 11 patents #2 of 3,003Top 1%
📍 Taipei, NY: #1 of 6 inventorsTop 20%
Overall (1994): #277 of 165,921Top 1%
11
Patents 1994

Issued Patents 1994

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
5376578 Method of fabricating a semiconductor device with raised diffusions and isolation Seiki Ogura, Joseph F. Shepard, Jr. 1994-12-27
5371022 Method of forming a novel vertical-gate CMOS compatible lateral bipolar transistor Chang-Ming Hsieh, Shaw-Ning Mei, Ronald W. Knepper, Lawrence F. Wagner, Jr. 1994-12-06
5369049 DRAM cell having raised source, drain and isolation Joyce Elizabeth Acocella, Seiki Ogura, Nivo Rovedo, Joseph F. Shepard, Jr. 1994-11-29
5366923 Bonded wafer structure having a buried insulation layer Klaus D. Beyer, Chang-Ming Hsieh, Tsorng-Dih Yuan 1994-11-22
5340759 Method of making a vertical gate transistor with low temperature epitaxial channel Chang-Ming Hsieh, Seiki Ogura 1994-08-23
5341023 Novel vertical-gate CMOS compatible lateral bipolar transistor Chang-Ming Hsieh, Shaw-Ning Mei, Ronald W. Knepper, Lawrence F. Wagner, Jr. 1994-08-23
5315151 Transistor structure utilizing a deposited epitaxial base region Chang-Ming Hsieh, Victor J. Silvestri 1994-05-24
5313094 Thermal dissipation of integrated circuits using diamond paths Klaus D. Beyer, Chang-Ming Hsieh, David E. Kotecki, Tsoring-Dih Yuan 1994-05-17
5300813 Refractory metal capped low resistivity metal conductor lines and vias Rajiv V. Joshi, Jerome J. Cuomo, Hormazdyar M. Dalal 1994-04-05
5283456 Vertical gate transistor with low temperature epitaxial channel Chang-Ming Hsieh, Seiki Ogura 1994-02-01
5276338 Bonded wafer structure having a buried insulation layer Klaus D. Beyer, Chang-Ming Hsieh, Tsorng-Dih Yuan 1994-01-04