Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366923 | Bonded wafer structure having a buried insulation layer | Klaus D. Beyer, Chang-Ming Hsieh, Louis L. Hsu | 1994-11-22 |
| 5276338 | Bonded wafer structure having a buried insulation layer | Klaus D. Beyer, Chang-Ming Hsieh, Louis L. Hsu | 1994-01-04 |