Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366923 | Bonded wafer structure having a buried insulation layer | Chang-Ming Hsieh, Louis L. Hsu, Tsorng-Dih Yuan | 1994-11-22 |
| 5313094 | Thermal dissipation of integrated circuits using diamond paths | Chang-Ming Hsieh, Louis L. Hsu, David E. Kotecki, Tsoring-Dih Yuan | 1994-05-17 |
| 5306659 | Reach-through isolation etching method for silicon-on-insulator devices | Andrie S. Yapsir | 1994-04-26 |
| 5276338 | Bonded wafer structure having a buried insulation layer | Chang-Ming Hsieh, Louis L. Hsu, Tsorng-Dih Yuan | 1994-01-04 |