Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371654 | Three dimensional high performance interconnection package | Brian S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more | 1994-12-06 |
| 5326643 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more | 1994-07-05 |
| 5296189 | Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith | Sung Kwon Kang, Sampath Purushothaman, Jane M. Shaw, Subhash L. Shinde | 1994-03-22 |