Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5337475 | Process for producing ceramic circuit structures having conductive vias | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more | 1994-08-16 |
| 5326643 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman +4 more | 1994-07-05 |
| 5283104 | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more | 1994-02-01 |