Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5326643 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman +4 more | 1994-07-05 |