TO

Tae S. Oh

IBM: 1 patents #741 of 3,003Top 25%
📍 Cheongnyang-eup, KR: #1 of 1 inventorsTop 100%
Overall (1994): #62,596 of 165,921Top 40%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5326643 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Terrence R. O'Toole, Sampath Purushothaman +4 more 1994-07-05