Issued Patents 1994
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371654 | Three dimensional high performance interconnection package | Brian S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more | 1994-12-06 |
| 5357234 | Current limiting fuse | Robert M. Pimpis, Richard J. Perreault, David E. Suuronen, Edward J. Knapp, Jr. | 1994-10-18 |
| 5337475 | Process for producing ceramic circuit structures having conductive vias | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more | 1994-08-16 |
| 5326643 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more | 1994-07-05 |
| 5319344 | Externally mounted blown fuse indicator | Jerry L. Mosesian, Howard J. Parker, Richard J. Perreault | 1994-06-07 |
| 5299939 | Spring array connector | Arthur R. Zingher | 1994-04-05 |
| 5283104 | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more | 1994-02-01 |