Issued Patents 1989
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4881885 | Dam for lead encapsulation | Peter G. Ledermann, Luu Thanh Nguyen | 1989-11-21 |
| 4869930 | Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization | Thomas Carl Clarke, Dae Young Jung, Jae Man Park, Richard R. Thomas | 1989-09-26 |
| 4862322 | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween | Harry R. Bickford, Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley +1 more | 1989-08-29 |
| 4832255 | Precision solder transfer method and means | Harry R. Bickford, Kurt R. Grebe, Michael J. Palmer | 1989-05-23 |