Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4881885 | Dam for lead encapsulation | Caroline A. Kovac, Luu Thanh Nguyen | 1989-11-21 |
| 4814855 | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape | Rodney T. Hodgson, Harry J. Jones, Timothy C. Reiley, Paul A. Moskowitz | 1989-03-21 |