Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4862322 | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween | Harry R. Bickford, Mark F. Bregman, Michael J. Palmer, Timothy C. Reiley, Paige A. Poore +1 more | 1989-08-29 |
| 4851767 | Detachable high-speed opto-electronic sampling probe | Jean-Marc Halbout, Mark B. Ketchen, Michael R. Scheuermann | 1989-07-25 |
| 4814855 | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape | Rodney T. Hodgson, Harry J. Jones, Peter G. Ledermann, Timothy C. Reiley | 1989-03-21 |