HB

Harry R. Bickford

IBM: 1 patents #253 of 1,444Top 20%
📍 Ossining, NY: #4 of 35 inventorsTop 15%
🗺 New York: #487 of 5,342 inventorsTop 10%
Overall (1989): #26,726 of 140,708Top 20%
2
Patents 1989

Issued Patents 1989

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
4862322 Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley, Paige A. Poore +1 more 1989-08-29
4832255 Precision solder transfer method and means Kurt R. Grebe, Caroline A. Kovac, Michael J. Palmer 1989-05-23