TR

Timothy C. Reiley

IBM: 1 patents #253 of 1,444Top 20%
📍 Ridgefield, CT: #5 of 47 inventorsTop 15%
🗺 Connecticut: #155 of 1,954 inventorsTop 8%
Overall (1989): #14,219 of 140,708Top 15%
2
Patents 1989

Issued Patents 1989

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
4862322 Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween Harry R. Bickford, Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Paige A. Poore +1 more 1989-08-29
4814855 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape Rodney T. Hodgson, Harry J. Jones, Peter G. Ledermann, Paul A. Moskowitz 1989-03-21