Issued Patents All Time
Showing 76–100 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8746850 | Patterned heater traces for inkjet printhead | Bradley J. Gerner | 2014-06-10 |
| 8740357 | Method and structure for sealing fine fluid features in a printing device | Bryan R. Dolan, Mark A. Cellura, John P. Meyeres, Lyle G. Dingman | 2014-06-03 |
| 8727508 | Bonded silicon structure for high density print head | Bijoyraj Sahu | 2014-05-20 |
| 8714722 | Multiple layer filter | Andrew W. Hays, Jun Ma, Bradley J. Gerner | 2014-05-06 |
| 8708465 | Method for protecting piezoelectric transducer | Mark A. Cellura, Bryan R. Dolan, Gary D. Redding | 2014-04-29 |
| 8696091 | Screen printed jet stack heater | Bradley J. Gerner, Andrew W. Hays | 2014-04-15 |
| 8684500 | Diaphragm for an electrostatic actuator in an ink jet printer | — | 2014-04-01 |
| 8646881 | Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays | Bryan R. Dolan, Gary D. Redding | 2014-02-11 |
| 8646875 | Independent adjustment of drop mass and velocity using stepped nozzles | Peter M. Gulvin, John R. Andrews, Gerald A. Domoto, Nicholas P. Kladias | 2014-02-11 |
| 8608293 | Process for adding thermoset layer to piezoelectric printhead | Gary D. Redding, Bryan R. Dolan, Mark A. Cellura | 2013-12-17 |
| 8584331 | In situ flexible circuit embossing to form an electrical interconnect | Bryan R. Dolan | 2013-11-19 |
| 8585183 | High density multilayer interconnect for print head | Mark A. Cellura, Gary D. Redding | 2013-11-19 |
| 8585187 | High density electrical interconnect for printing devices using flex circuits and dielectric underfill | Gary D. Redding, Mark A. Cellura | 2013-11-19 |
| 8585185 | High density electrical interconnect using limited density flex circuits | Scott Taylor Treece, Bryan R. Dolan | 2013-11-19 |
| 8567924 | Patterned conductive array and self leveling epoxy | Bradley J. Gerner, Bryan R. Dolan, John R. Andrews | 2013-10-29 |
| 8567911 | Silicon interposer for MEMS scalable printing modules | Donald J. Drake | 2013-10-29 |
| 8556611 | Method for interstitial polymer planarization using a flexible flat plate | Bryan R. Dolan, Gary D. Redding, Mark A. Cellura, John R. Andrews | 2013-10-15 |
| 8550601 | Use of photoresist material as an interstitial fill for PZT printhead fabrication | Mark A. Cellura, Kock-Yee Law, John P. Meyers, Gary D. Redding, Yuanjia Zhang | 2013-10-08 |
| 8455271 | Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads | Peter M. Gulvin, Paul W. Browne | 2013-06-04 |
| 8450902 | Electrostatic actuator device having multiple gap heights | Peter M. Gulvin | 2013-05-28 |
| 8393713 | Ink jet printing systems and methods with pre-fill and dimple design | Andrew W. Hays, Richard P. Germain, Joseph A. DeGroot, Jun Ma | 2013-03-12 |
| 8358047 | Buried traces for sealed electrostatic membrane actuators or sensors | Peter M. Gulvin | 2013-01-22 |
| 8342652 | Molded nozzle plate with alignment features for simplified assembly | Scott J. Phillips, Mark A. Cellura | 2013-01-01 |
| 8235500 | Cast-in place ink feed structure using encapsulant | John P. Meyers | 2012-08-07 |
| 8220896 | Printhead de-prime system and method for solid ink systems | Andrew W. Hays, Scott J. Phillips | 2012-07-17 |