Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122178 | Imaging blanket and variable data lithography system employing the imaging blanket | Varun Sambhy, Santokh S. Badesha, Peter J. Nystrom, Lina Bian | 2024-10-22 |
| 11766829 | Surface treated additive manufacturing printhead nozzles and methods for the same | Santokh S. Badesha, Varun Sambhy, Chu-heng Liu, Peter M. Gulvin, Mark A. Cellura +2 more | 2023-09-26 |
| 11383417 | Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers | David A. Mantell, Peter J. Nystrom, Christopher G. Lynn, Jun Ma, Mark A. Cellura | 2022-07-12 |
| 11025796 | Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays | Joseph F. Casey, Robert P. Herloski | 2021-06-01 |
| 10943895 | Method of fabricating a plurality of linear arrays with submicron y-axis alignment | Joseph F. Casey | 2021-03-09 |
| 10814544 | Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers | David A. Mantell, Peter J. Nystrom, Christopher G. Lynn, Jun Ma, Mark A. Cellura | 2020-10-27 |
| 10625466 | Extrusion printheads for three-dimensional object printers | Barry P. Mandel, David A. Mantell, Peter J. Nystrom, Andrew W. Hays, Mark A. Cellura +1 more | 2020-04-21 |
| 10629515 | System and method for cooling digital mirror devices | Roger G. Leighton, Mark A. Adiletta, Christopher D. Atwood, Ali R. Dergham, Francisco Zirilli +1 more | 2020-04-21 |
| 10421277 | Lead-free piezo printhead using thinned bulk material | Peter J. Nystrom, Angus Kingon, Seunghyun Kim, Nicholas Mostovych | 2019-09-24 |
| 10252525 | Lead-free piezo printhead using thinned bulk material | Peter J. Nystrom, Angus Kingon, Seunghyun Kim, Nicholas Mostovych | 2019-04-09 |
| 10166777 | Method of forming piezo driver electrodes | Peter J. Nystrom, Peter M. Gulvin, Mark A. Cellura | 2019-01-01 |
| 10134793 | Method of forming two-dimensional and three-dimensional semiconductor chip arrays | Joseph F. Casey, Craig Alan Zufelt, Michael B. Monahan | 2018-11-20 |
| 9931843 | Raised fluid pass-through structure in print heads | Jonathan Robert Brick, Chad David Freitag, Garry Adam Jones, Jon G. Judge, David R. Koehler +3 more | 2018-04-03 |
| 9802408 | Raised fluid pass-through structure in print heads | Jonathan Robert Brick, Chad David Freitag, Garry Adam Jones, Jon G. Judge, David R. Koehler +3 more | 2017-10-31 |
| 9757900 | Pin-actuated printhead | Peter J. Nystrom, Barry P. Mandel, Andrew W. Hays, Jun Ma, David A. Mantell +1 more | 2017-09-12 |
| 9421772 | Method of manufacturing ink jet printheads including electrostatic actuators | Peter J. Nystrom, Mark A. Cellura | 2016-08-23 |
| 9375926 | Membrane bond alignment for electrostatic ink jet printhead | Peter J. Nystrom, Mark A. Cellura, Andrew W. Hays | 2016-06-28 |
| 9321265 | Electrostatic actuator with short circuit protection and process | Peter J. Nystrom, Mark A. Cellura, Peter M. Gulvin | 2016-04-26 |
| 9302472 | Printhead configured to refill nozzle areas with high viscosity materials | David A. Mantell, Peter J. Nystrom, Peter M. Gulvin, Andrew W. Hays, Jun Ma | 2016-04-05 |
| 9238365 | Flex circuit board with topographical structures to facilitate fluid flow through the layer | Peter J. Nystrom, Mark A. Cellura, Jon G. Judge, Chad David Freitag, Samuel Schultz +1 more | 2016-01-19 |
| 9168747 | Multi-layer electroformed nozzle plate with attenuation pockets | Mark A. Cellura, Peter J. Nystrom, Andrew W. Hays | 2015-10-27 |
| 9139004 | Print head transducer dicing directly on diaphragm | Antonio L. Williams, John P. Meyers | 2015-09-22 |
| 9073321 | Printhead layer design for compatibility with wet adhesive application processes | Mark A. Cellura | 2015-07-07 |
| 9073322 | Electrostatic device improved membrane bonding | Peter J. Nystrom | 2015-07-07 |
| 8984752 | Printhead fabrication using additive manufacturing techniques | Mark A. Cellura, Bryan R. Dolan | 2015-03-24 |