AK

Angus Kingon

NU North Carolina State University: 5 patents #137 of 1,607Top 9%
BU Brown University: 4 patents #33 of 478Top 7%
Xerox: 4 patents #2,608 of 8,622Top 35%
Fujitsu Limited: 3 patents #8,614 of 24,456Top 40%
AV American Research Corporation Of Virginia: 2 patents #9 of 29Top 35%
Motorola: 2 patents #4,475 of 12,470Top 40%
LA Lilliwyte Societe Anonyme: 1 patents #15 of 29Top 55%
EA E.I. Du Pont De Nemours And: 1 patents #4,343 of 8,010Top 55%
CS Csir: 1 patents #82 of 220Top 40%
📍 Warren, RI: #2 of 73 inventorsTop 3%
🗺 Rhode Island: #230 of 6,211 inventorsTop 4%
Overall (All Time): #208,428 of 4,157,543Top 6%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
10421277 Lead-free piezo printhead using thinned bulk material Peter J. Nystrom, Gary D. Redding, Seunghyun Kim, Nicholas Mostovych 2019-09-24
10399887 Method and apparatus for creating coherent bundle of scintillating fibers Theodore F. Morse, Rajiv Gupta, Avilash Cramer, Christopher Bull, Paul Waltz 2019-09-03
10358376 Method and apparatus for creating coherent bundle of scintillating fibers Theodore F. Morse, Rajiv Gupta, Avilash Cramer, Christopher Bull, Paul Waltz 2019-07-23
10252525 Lead-free piezo printhead using thinned bulk material Peter J. Nystrom, Gary D. Redding, Seunghyun Kim, Nicholas Mostovych 2019-04-09
9738070 Integrated piezo printhead Peter J. Nystrom, Andrew W. Hays, Seunghyun Kim 2017-08-22
9662880 Integrated thin film piezoelectric printhead Andrew W. Hays, Peter J. Nystrom, Seunghyun Kim 2017-05-30
7241656 Semiconductor device and its manufacture method, and measurement fixture for the semiconductor device Jeffrey Scott Cross, Mineharu Tsukada, Yoshimasa Horii, Alexei Gruverman 2007-07-10
7239026 Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip Jeffrey Scott Cross, Mineharu Tsukada, Yoshimasa Horii, Alexei Gruverman 2007-07-03
7075135 Semiconductor device having a stress layer for applying tensile of compressive stress to the ferroelectric film Jeffrey Scott Cross, Mineharu Tsukada, Yoshimasa Horii, Alexei Gruverman 2006-07-11
7074507 Structures including perovskite dielectric layers and variable oxygen concentration gradient layers Jon-Paul Maria 2006-07-11
7029971 Thin film dielectrics for capacitors and methods of making thereof William Borland, Jon Ihlefeld, Jon-Paul Maria 2006-04-18
6936301 Methods of controlling oxygen partial pressure during annealing of a perovskite dielectric layer Jon-Paul Maria 2005-08-30
6841080 Multi-layer conductor-dielectric oxide structure Gregory J. Dunn, Stephen Streiffer, Kevin Cheek, Min-Xian Zhang, Jon-Paul Maria +1 more 2005-01-11
6753567 Lanthanum oxide-based dielectrics for integrated circuit capacitors Jon-Paul Maria 2004-06-22
6541137 Multi-layer conductor-dielectric oxide structure Gregory J. Dunn, Stephen Streiffer, Kevin Cheek, Min-Xian Zhang, Jon-Paul Maria +1 more 2003-04-01
6531354 Lanthanum oxide-based gate dielectrics for integrated circuit field effect transistors Jon-Paul Maria 2003-03-11
5850089 Modulated-structure of PZT/PT ferroelectric thin films for non-volatile random access memories Usha Varshney 1998-12-15
5626670 Method for producing low thermal budget ferroelectric thin films for integrated device structures using laser-crystallization of spin-on sol-gel films Usha Varshney 1997-05-06
5555486 Hybrid metal/metal oxide electrodes for ferroelectric capacitors Husam N. Al-Shareef, Orlando H. Auciello, Ken D. Gifford, Dan J. Lichtenwalner, Rovindra Dat 1996-09-10
5017532 Sintered ceramic product Neville Sonnenberg, Adrian W. Paterson 1991-05-21
4732741 "Method of making beta""-alumina" James H. Duncan, Peter Barrow, Arnold Van Zyl 1988-03-22