Issued Patents All Time
Showing 51–75 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9302472 | Printhead configured to refill nozzle areas with high viscosity materials | David A. Mantell, Peter M. Gulvin, Andrew W. Hays, Jun Ma, Gary D. Redding | 2016-04-05 |
| 9253420 | Hyperspectral single pixel imager with fabry perot filter | Lalit Keshav Mestha, Edgar A. Bernal, Xuejin Wen, Peter M. Gulvin | 2016-02-02 |
| 9238365 | Flex circuit board with topographical structures to facilitate fluid flow through the layer | Gary D. Redding, Mark A. Cellura, Jon G. Judge, Chad David Freitag, Samuel Schultz +1 more | 2016-01-19 |
| 9174440 | Independent adjustment of drop mass and drop speed using nozzle diameter and taper angle | Nicholas P. Kladias, John R. Andrews, Gerald A. Domoto, Peter M. Gulvin | 2015-11-03 |
| 9168747 | Multi-layer electroformed nozzle plate with attenuation pockets | Gary D. Redding, Mark A. Cellura, Andrew W. Hays | 2015-10-27 |
| 9102148 | Electrostatic membrane diffusion bonding structure and process | David L. Knierim | 2015-08-11 |
| 9079392 | Double sided flex for improved bump interconnect | — | 2015-07-14 |
| 9073322 | Electrostatic device improved membrane bonding | Gary D. Redding | 2015-07-07 |
| 9038269 | Printhead with nanotips for nanoscale printing and manufacturing | Andrew W. Hays, Bijoyraj Sahu | 2015-05-26 |
| 9016835 | MEMS actuator pressure compensation structure for decreasing humidity | Barry P. Mandel | 2015-04-28 |
| 9004652 | Thermo-pneumatic actuator fabricated using silicon-on-insulator (SOI) | Andrew W. Hays, Peter M. Gulvin | 2015-04-14 |
| 9004651 | Thermo-pneumatic actuator working fluid layer | Andrew W. Hays | 2015-04-14 |
| 8979241 | Using saturated mesh to control adhesive bond line quality | Yanjia Zuo | 2015-03-17 |
| 8967686 | Fitting arrangement for a door handle | Peter Rudhager | 2015-03-03 |
| 8931879 | Laser transmission laminating of materials for ink jet printheads | Mark A. Cellura, Bijoyraj Sahu | 2015-01-13 |
| 8919915 | Ultrasonic laminating of materials for ink jet printheads | Mark A. Cellura, Bijoyraj Sahu | 2014-12-30 |
| 8888254 | High density three-dimensional electrical interconnections | Xuejin Wen, Gary D. Redding, Jun Ma | 2014-11-18 |
| 8857021 | Laser welded bonding pads for piezoelectric print heads | Bradley J. Gerner, Bryan R. Dolan | 2014-10-14 |
| 8845907 | Structure and method to fabricate tooling for bumping thin flex circuits | Bryan R. Dolan, Gary D. Redding | 2014-09-30 |
| 8826539 | Method for flex circuit bonding without solder mask for high density electrical interconnect | Bryan R. Dolan | 2014-09-09 |
| 8828750 | Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads | Peter M. Gulvin, Paul W. Browne | 2014-09-09 |
| 8814326 | Reduced mechanical coupling with structured flex circuits | Bryan R. Dolan, Bradley J. Gerner | 2014-08-26 |
| 8814328 | Polymer film as an interstitial fill for PZT printhead fabrication | Gary D. Redding, Bryan R. Dolan, Mark A. Cellura | 2014-08-26 |
| 8794743 | Multi-film adhesive design for interfacial bonding printhead structures | Yanjia Zuo, James M. Casella, Santokh S. Badesha, Antonio L. Williams, Thomas J. Wyble +1 more | 2014-08-05 |
| 8746848 | Ink jet printing systems and methods with pre-fill and dimple design | Andrew W. Hays, Richard P. Germain, Joseph A. DeGroot, Jun Ma | 2014-06-10 |